SACHEM Unveils New Solutions for IGZO and Smooth Silicon Etching at SEMICON Korea

SACHEM (booth #1242) is exhibiting at Semicon Korea in Seoul February 12-14th. SACHEM experts will be on hand to discuss our proven product lines designed specifically for the microelectronics manufacturing industry. Additionally SACHEM is unveiling two new solutions in the In-Ga-Zn-O (IGZO) and smooth silicon etching processes.

SACHEM has designed new wet chemical, damage-free etchants for IGZO-based TFT manufacturing. These proprietary formulations substantially increase the selective etching of the source/drain metals: aluminum, molybdenum, copper and titanium. The use of an etch stop layer to protect the IGZO channel is no longer required. This new solution will be the newest member of the Devera™ family of products.

Devera™ is a portfolio of chemicals for formulators creating solutions specifically designed for the requirements of flat panel (FPD) and light emitting diode (LED) manufacturing challenges. In an environment of competitive pressure relating to total cost and technology innovation, SACHEM’s Devera™ portfolio drives leading edge technologies that exceed the demands for improving performance, cost effectiveness and safety.

SACHEM’s TSV Reveal Etch solution is specially designed for fast silicon etching and smooth surface finishing. This product has an etch rate 2-4 times faster than TMAH and KOH. This new solution is part of a portfolio of chemical components used by formulators creating wafer cleaning, stripping, selective etching, and photoresist developer chemical solutions for 3D packaging applications.

Stop by our booth #1242 and discuss the challenges and opportunities of today’s semiconductor market. We love to talk chemistry! http://ift.tt/1grJ501

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