Toshiba Corporation announced the launch of ultra-small chip scale package white LEDs for lighting applications that can reduce the mounting area by 90% compared to conventional 3.0 x 1.4 mm package products. [1] The new TL1WK series will start sample shipment from April.
The new products utilize gallium nitride-on-silicon (GaN-on-Si) process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs[2], with a package size of just 0.65 x 0.65mm, but they achieve a luminous efficacy of 130lm/W[3] and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.
The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30 to April 4.
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